首页> 外文期刊>IEEE transactions on very large scale integration (VLSI) systems >ATM switching architectures for wafer-scale integration
【24h】

ATM switching architectures for wafer-scale integration

机译:用于晶圆规模集成的ATM交换架构

获取原文
获取原文并翻译 | 示例
           

摘要

This paper proposes the use of wafer-scale integration (WSI) technology for ATM switching systems and presents two different switching architectures specifically designed for WSI. WSI is particularly useful for switching networks since the interconnection lengths are minimized when the entire network is laid out on a single semiconductor wafer. We propose a defect-tolerant multipath buffered crossbar (MBC) with an expandable structure which can easily be scaled up or down according to the choice of wafer size. We also design an ATM-based Manhattan-street network (MSN) as an alternative architecture, suitable for wafer-scale implementation. We compare the two architectures from different standpoints such as performance, defect-tolerance, delay, practicality, testability, complexity, yield, and area.
机译:本文提出了将晶片级集成(WSI)技术用于ATM交换系统的方法,并提出了两种专为WSI设计的不同交换体系结构。 WSI对于交换网络特别有用,因为当整个网络都放在单个半导体晶圆上时,互连长度会最小化。我们提出了一种具有可扩展结构的容错多路径缓冲交叉开关(MBC),该结构可以根据晶圆尺寸的选择轻松地按比例放大或缩小。我们还设计了一个基于ATM的曼哈顿街道网络(MSN)作为替代体系结构,适用于晶圆级实施。我们从不同的角度比较了两种体系结构,例如性能,容错性,延迟,实用性,可测试性,复杂性,良率和面积。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号