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Low-power repeaters driving RC and RLC interconnects with delay and bandwidth constraints

机译:低功耗中继器可在具有延迟和带宽限制的情况下驱动RC和RLC互连

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摘要

Interconnect plays an increasingly important role in deep-submicrometer very large scale integrated technologies. Multiple design criteria are considered in interconnect design, such as delay, power, and bandwidth. In this paper, a repeater insertion methodology is presented for achieving the minimum power in an RC interconnect while satisfying delay and bandwidth constraints. These constraints determine a design space for the number and size of the repeaters. The minimum power is shown to occur at the edge of the design space. With delay constraints, closed form solutions for the minimum power are developed, where the average error is 7% as compared with SPICE. With bandwidth constraints, the minimum power can be achieved with minimum-sized repeaters. The effects of inductance on the delay, bandwidth, and power of an RLC interconnect with repeaters are also analyzed. By including inductance, the minimum interconnect power under a delay or bandwidth constraint decreases as compared with an RC interconnect.
机译:互连在深亚微米超大规模集成技术中扮演着越来越重要的角色。互连设计中考虑了多个设计标准,例如延迟,功率和带宽。在本文中,提出了一种中继器插入方法,该方法可在满足延迟和带宽约束的同时实现RC互连中的最小功率。这些限制决定了转发器的数量和大小的设计空间。最小功率显示在设计空间的边缘。由于存在延迟限制,因此开发了最小功率的封闭式解决方案,与SPICE相比,平均误差为7%。在带宽限制下,可以使用最小尺寸的转发器来实现最小功率。还分析了电感对带有中继器的RLC互连的延迟,带宽和功率的影响。通过包括电感,与RC互连相比,在延迟或带宽约束下的最小互连功率降低了。

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