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Quasi-Resonant Interconnects: A Low Power, Low Latency Design Methodology

机译:准谐振互连:一种低功耗,低延迟的设计方法

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Design and analysis guidelines for quasi-resonant interconnect networks (QRN) are presented in this paper. The methodology focuses on developing an accurate analytic distributed model of the on-chip interconnect and inductor to obtain both low power and low latency. Excellent agreement is shown between the proposed model and SpectraS simulations. The analysis and design of the inductor, insertion point, and driver resistance for minimum power-delay product is described. A case study demonstrates the design of a quasi-resonant interconnect, transmitting a 5 Gb/s data signal along a 5 mm line in a TSMC 0.18-$mu$m CMOS technology. As compared to classical repeater insertion, an average reduction of 91.1% and 37.8% is obtained in power consumption and delay, respectively. As compared to optical links, a reduction of 97.1% and 35.6% is observed in power consumption and delay, respectively.
机译:本文介绍了准谐振互连网络(QRN)的设计和分析指南。该方法专注于开发片上互连和电感器的精确分析分布式模型,以获得低功耗和低延迟。在建议的模型和SpectraS仿真之间显示出极好的一致性。描述了用于最小功率延迟乘积的电感器,插入点和驱动器电阻的分析和设计。案例研究演示了准谐振互连的设计,采用TSMC0.18-μmCMOS技术沿5毫米线传输5 Gb / s数据信号。与经典中继器插入相比,功耗和延迟分别平均降低了91.1%和37.8%。与光链路相比,功耗和延迟分别降低了97.1%和35.6%。

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