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Design Paradigm for Robust Spin-Torque Transfer Magnetic RAM (STT MRAM) From Circuit/Architecture Perspective

机译:从电路/体系结构角度看鲁棒自旋扭矩传递磁性RAM(STT MRAM)的设计范例

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Spin-torque transfer magnetic RAM (STT MRAM) is a promising candidate for future embedded applications. It combines the desirable attributes of current memory technologies such as SRAM, DRAM, and flash memories (fast access time, low cost, high density, and non-volatility). It also solves the critical drawbacks of conventional MRAM technology: poor scalability and high write current. However, variations in process parameters can lead to a large number of cells to fail, severely affecting the yield of the memory array. In this paper, we analyzed and modeled the failure probabilities of STT MRAM cells due to parameter variations. Based on the model, we performed a thorough analysis of the impact of design parameters on parametric failures due to process variations. To achieve high memory yield without incurring expensive technology modification, we developed an efficient design paradigm from circuit and/or architecture perspective—to improve the robustness and integration density. The proposed technique effectively relaxes or completely decouples the conflicting design requirements for read stability, writability and cell area. It can be used at an early stage of the design cycle for yield enhancement.
机译:自旋扭矩传递磁性RAM(STT MRAM)是未来嵌入式应用的有希望的候选者。它结合了诸如SRAM,DRAM和闪存之类的当前存储技术的理想属性(快速访问时间,低成本,高密度和非易失性)。它还解决了传统MRAM技术的关键缺陷:可伸缩性差和高写入电流。然而,工艺参数的变化会导致大量单元失效,从而严重影响存储器阵列的产量。在本文中,我们分析和建模了由于参数变化而引起的STT MRAM单元的故障概率。基于该模型,我们对设计参数对由于工艺变化引起的参数故障的影响进行了全面分析。为了在不引起昂贵技术修改的情况下获得高存储量,我们从电路和/或架构的角度开发了一种有效的设计范例-以提高鲁棒性和集成密度。所提出的技术有效地放松了或完全解耦了对读取稳定性,可写性和单元区域的冲突设计要求。它可以在设计周期的早期阶段用于提高良率。

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