Low-Power High-Density STT MRAMs on a 3-D Vertical Silicon Nanowire Platform

摘要

In recent years, researchers have focused toward reduction in power dissipation and cell size to employ spin-transfer torque (STT) magnetic random-access memories (MRAMs) for embedded applications. Hence, the magnetic tunnel junctions (MTJs) with an optimized structure and magnetic properties are being explored to reduce the switching current. However, the switching current reduction in the MTJs generally lowers the data-retention capability. Hence, a different approach to reduce power dissipation using a novel select device should be considered. This paper, therefore, explores the STT MRAM with vertical silicon nanowire gate all around (GAA) high- select device for superior performance. The MTJ is stacked above the vertical GAA device, so that both occupy the same footprint area to achieve high array density. Furthermore, enhancement of current drive using high- gate dielectric and its impact on the STT MRAMs are analyzed at different feature sizes. The proposed STT MRAM cell with high- dielectric (HfO) lowers the power dissipation by 8%–25% and increases the write margins (WMs) up to 38%, with negligible increment in delay in comparison with the GAA device using low- dielectric (SiO). Moreover, asymmetricity is introduced in device configuration to achieve power savings of 25%–30% at high . The proposed asymmetric high- cell offers a substantially larger tradeoff window between high WMs and low power dissipation.