Examination of improvement effect of surface modification of Cu with organic acid on solder paste wettability using a laser displacement meter

摘要

The conclusions of this study are summarized as follows. 1. The difference of the wettability of the solder paste which depends on the surface modification of Cu is revealed by the measurement of the descent speed of a Cu fragment with a laser displacement meter. 2. The wettability of the solder paste to the Cu surface is rapidly improved by a surface modification process which uses an organic acid.