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首页> 外文期刊>Surface Science >Properties of the SiO2/SiC interface investigated by angle resolved studies of the Si 2p and Si 1s levels and the Si KLL Auger transitions
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Properties of the SiO2/SiC interface investigated by angle resolved studies of the Si 2p and Si 1s levels and the Si KLL Auger transitions

机译:通过角度分辨研究Si 2p和Si 1s含量以及Si KLL Auger跃迁来研究SiO2 / SiC界面的性能

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摘要

Angle resolved photoemission studies of the Si 2p and Si Is core levels and the Si KL2,3L2,3 Auger transitions from SiO2/SiC samples are reported. Most samples investigated were grown in situ on initially clean and well ordered root3 x root3 reconstructed 4H-SiC(0 0 0 1) surfaces but some samples were grown ex situ using a standard dry oxidation procedure. The results presented cover samples with total oxide thicknesses from about 5 to 118 Angstrom. The angle resolved data show that two oxidation states only, Si+1 and Si+4, are required to explain and model recorded Si 2p, Si Is and Si KLL spectra. The intensity variations observed in the core level components versus electron emission angle are found to be well described by a layer attenuation model for all samples when assuming a sub-oxide (Si2O) at the interface with a thickness ranging from 2.5 to 4 Angstrom. We conclude that the sub-oxide is located at the interface and that the thickness of this layer does not increase much when the total oxide thickness is increased from about 5 to 118 Angstrom. The SiO2 chemical shift is found to be larger in the Si Is level than in the Si 2p level and to depend on the thickness of the oxide layer. The SiO2 shift is found to be fairly constant for oxides less than about 10 Angstrom thick, to increase by 0.5 eV when increasing the oxide thickness to around 25 Angstrom and then to be fairly constant for thicker oxides. An even more pronounced dependence is observed in the Si KLL transitions where a relative energy shift of 0.9 eV is determined. The relative final state relaxation energy DeltaR(2p) is determined from the modified Auger parameter. This yields a value of DeltaR(2p) = -1.7 eV and implies, for SiO2/SiC, a "true" chemical shift in the Si 2p level of only approximate to0.4 eV for oxide layers of up to 10 Angstrom thick. (C) 2003 Elsevier Science B.V. All rights reserved. [References: 30]
机译:报道了对SiO 2 / SiC样品中Si 2p和Si Is核能级以及Si KL2,3L2,3 Auger跃迁的角度分辨光发射研究。研究的大多数样品都是在最初干净且有序的root3 x root3重建的4H-SiC(0 0 0 1)表面上原位生长的,但有些样品是使用标准的干式氧化程序异位生长的。结果给出了覆盖样品的总氧化物厚度为约5至118埃。角度解析数据表明,仅需要两个氧化态Si + 1和Si + 4即可解释和建模记录的Si 2p,Si Is和Si KLL光谱。当假设界面处的亚氧化物(Si2O)厚度范围为2.5至4埃时,对于所有样品,通过层衰减模型可以很好地描述在核心能级分量中观察到的相对于电子发射角的强度变化。我们得出的结论是,次氧化物位于界面处,并且当总氧化物厚度从约5埃增加到118埃时,该层的厚度不会增加太多。发现SiO 2化学位移在Si Is水平比在Si 2p水平大,并且取决于氧化物层的厚度。发现对于小于约10埃厚的氧化物,SiO 2位移相当恒定,当将氧化物厚度增加至约25埃时,SiO 2位移增加0.5eV,然后对于较厚的氧化物,SiO 2位移相当恒定。在Si KLL跃迁中观察到更加明显的依赖性,其中确定了0.9 eV的相对能移。相对最终状态弛豫能量DeltaR(2p)由修改后的俄歇参数确定。这产生了DeltaR(2p)= -1.7 eV的值,并且对于SiO2 / SiC而言,对于厚度不超过10埃的氧化物层,Si 2p水平的“真实”化学位移仅为大约0.4 eV。 (C)2003 Elsevier Science B.V.保留所有权利。 [参考:30]

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