Highl'/> Critical thickness of transition from 2D to 3D growth and peculiarities of quantum dots formation in Ge_xSi_(1-x)/Sn/Si and Ge_(1-y)Sn_y/Si systems
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Critical thickness of transition from 2D to 3D growth and peculiarities of quantum dots formation in Ge_xSi_(1-x)/Sn/Si and Ge_(1-y)Sn_y/Si systems

机译:Ge_xSi_(1-x)/ Sn / Si和Ge_(1-y)Sn_y / Si系统中从2D到3D生长的临界转变厚度以及量子点形成的特殊性

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HighlightsNew approach for modeling growth processes of semiconductor compounds is presented.Decrease in 2D-3D transition temperatures for GeSiSn/Si compared to GeSi/Si is explained.Dependencies of critical thickness on temperature and composition are explained.Islands size decreases with increase in deposition rate and decrease of temperature.The simulated data are in a good agreement with experimentally observed results.AbstractNowadays using of tin as one of the deposited materials in GeSi/Sn/Si, GeSn/Si and GeSiSn/Si material systems is one of the most topical problems. These materials are very promising for various applications in nanoelectronics and optoelectronics due to possibility of band gap management and synthesis of direct band semiconductors within these systems. However, there is a lack of theoretical investigations devoted to the peculiarities of germanium on silicon growth in the presence of tin. In this paper a new theoretical approach for modeling growth processes of binary and ternary semiconductor compounds during the molecular beam epitaxy in these systems is presented. The established kinetic model based on the general nucleation theory takes into account the change in physical and mechanical parameters, diffusion coefficient and surface energies in the presence of tin. With the help of the developed model the experimentally observed significant decrease in the 2D-3D transition temperatures for GeSiSn/Si system compared to GeSi/Si system is theoretically explained for the first time in the literature. Besides that, the derived expressions allow one to explain the experimentally observed temperature dependencies of the critical thickness, as well as to predict the average size and surface density of quantum dots for different contents and temperatures in growth experiment, that confirms applicability of the model proposed. Moreover, the established model can be easily applied to other material systems in which the Stranski–Krastanow growth mode occurs.Graphical abstractDisplay Omitted
机译: 突出显示 提出了一种用于建模半导体化合物生长过程的新方法。 与GeSi / Si相比,GeSiSn / Si的2D-3D转变温度降低。 解释了临界厚度对温度和成分的依赖性。 岛的大小随着沉积速率的增加和温度的降低而减小。 模拟数据与实验观察到的结果非常吻合。 摘要 如今使用锡作为一种GeSi / Sn / Si,GeSn / Si和GeSiSn / Si材料系统中的沉积材料中,最热门的问题之一是。由于带隙管理和这些系统中直接带半导体的合成的可能性,这些材料对于纳米电子和光电子的各种应用非常有前途。但是,缺乏关于锡存在下锗对硅生长的特殊性的理论研究。本文提出了一种新的理论方法,用于模拟这些系统中分子束外延过程中二元和三元半导体化合物的生长过程。基于一般成核理论建立的动力学模型考虑了存在锡时物理和机械参数,扩散系数和表面能的变化。在开发的模型的帮助下,从理论上首次解释了与GeSi / Si系统相比,GeSiSn / Si系统的2D-3D转变温度的显着降低。除此之外,导出的表达式还可以解释实验观察到的临界厚度的温度依赖性,并可以预测生长实验中不同含量和温度的量子点的平均大小和表面密度,从而证实了所提出模型的适用性。此外,所建立的模型可以很容易地应用于发生Stranski-Krastanow增长模式的其他材料系统。 图形摘要 省略显示

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