Selective wave soldering requires spe-cialized equipment and processes to solder connectors. PIP reflow evolved as a way to accomplish through-hole assembly without additional equipment or process steps. In the PIP method, the additional solder required to fill the though-hole barrel is deposited by overprinting the pad in the area of each connector pin using standard SMT equipment. During reflow, the solder wicks to each pin, forming the solder fillet. The task of determining the best board configuration for assembly is made increasingly difficult by tighter component densities, changing board thickness, more fine-pitch devices, changing surface finishes, greater power demands, increasing reliability concerns, upcoming lead-free technology, and more. These challenges are aggravated by ever-increasing demands for lower costs, which can be translated into greater throughput, fewer processes, less equipment and higher yields.
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