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Lead-free Reliability: Equal or Better?

机译:无铅可靠性:等于或更好?

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摘要

Lead (Pb) historically has been used with tin (Sn) in solders because SnPb alloys process well, require low melting temperatures and wet copper effectively. These attributes, in addition to the abundance and low cost of lead, have made SnPb solders the material of choice for millennia. SnPb solder was more ancient to Alexander the Great than he is to us. However, the toxicity of lead is driving SnPb's "demise" as the solder of choice for electronics applications.
机译:铅(Pb)过去一直与焊料中的锡(Sn)一起使用,因为SnPb合金加工性能好,需要较低的熔化温度并有效地润湿铜。这些特性,除了铅的丰富和低成本外,还使SnPb焊料成为了几千年的首选材料。 SnPb焊料对亚历山大大帝而言比对我们而言更古老。但是,铅的毒性正在驱使SnPb成为电子应用中选择的焊料的“灭亡”。

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