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首页> 外文期刊>Superlattices and microstructures >Stress study of GaN grown on serpentine-channels masked Si(111) substrate by MOCVD
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Stress study of GaN grown on serpentine-channels masked Si(111) substrate by MOCVD

机译:通过MOCVD在蛇形通道掩蔽的Si(111)衬底上生长的GaN的应力研究

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摘要

An advanced epitaxial lateral overgrowth (ELOG) structure named "serpentine-channels masked Si(111) substrate" has been introduced, which only has one high-defect region per period compared with the conventional ELOG method. We successfully obtained both coalesced and uncoalesced GaN layers on the substrate simultaneously by the metal-organic chemical vapor deposition (MOCVD) method. The stress states of these two kinds of GaN epilayers were investigated by room-temperature micro-Raman scattering technique. The stress level in the uncoalesced GaN layer was a little lower than that in the coalesced GaN layer. Raman spectra reveal the periodical variations of residual tensile stress in GaN by analyzing E_2 (high) phonon mode. In addition, thermal stress distribution of GaN was simulated by elasticity theory using the finite-element method (FEM). The results of simulation are entirely consistent with the experimental results derived from micro-Raman measurements.
机译:引入了一种先进的外延横向过生长(ELOG)结构,称为“蛇形通道掩盖的Si(111)衬底”,与传统的ELOG方法相比,每个周期只有一个高缺陷区域。通过金属有机化学气相沉积(MOCVD)方法,我们成功地在基板上同时获得了聚结和非凸析的GaN层。通过室温微拉曼散射技术研究了这两种GaN外延层的应力状态。未凝结的GaN层中的应力水平略低于聚结的GaN层中的应力水平。拉曼光谱通过分析E_2(高)声子模式揭示了GaN中残余拉应力的周期性变化。此外,利用有限元方法(FEM)通过弹性理论模拟了GaN的热应力分布。模拟结果与从微拉曼测量得出的实验结果完全一致。

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