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Experimental study and characterization of an ultrahigh-voltage Ni/4H-SiC junction barrier Schottky rectifier with near ideal performances

机译:性能接近理想的超高压Ni / 4H-SiC结势垒肖特基整流器的实验研究与表征

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摘要

An ultra-high voltage SiC JBS (silicon carbide junction barrier Schottky) rectifier utilizing a novel area-efficient multi-zone gradient modulated field limiting ring (MGM-FLR) technique have been fabricated, measured, and analysed in this paper. Ni-Schottky metal with a high barrier height is used to achieve a better trade-off between the on-resistance and the breakdown voltage. MGM-FLR, which is implanted simultaneously with the P grids within the active area of the device, forms a similar variation of lateral doping to mitigate the electric field crowding caused by junction curvature effect and obtains a maximum blocking voltage with minimally sized edge termination area. The fabricated device is tested to obtain a specific on-resistance is 140 mΩ cm~2 and a reverse breakdown voltage of 14 kV with the leakage current of 10 μA, which is quite close to the theoretical value of parallel plane junction calculated using the device parameter of drift region 100 μm and the concentration 5 × 10~(14) cm~(-3). The highest Baliga's figure-of-merit (BFOM) 5.6 GW/cm~2 was obtained for the proposed devices. Furthermore, the distribution of the extracted barrier height versus ideality factor on the wafer are demonstrated using I-V method. Impacts of ring spacing and zone of MGM-FLR termination on SiC device reverse blocking performance are also investigated in detail.
机译:本文利用一种新颖的面积有效的多区域梯度调制场限制环(MGM-FLR)技术制造,测量和分析了超高压SiC JBS(碳化硅结势垒肖特基)整流器。具有高势垒高度的Ni-Schottky金属用于在导通电阻和击穿电压之间实现更好的折衷。 MGM-FLR与器件有源区域中的P栅栅同时植入,形成了类似的横向掺杂变化,以减轻由结曲率效应引起的电场拥挤,并以最小尺寸的边缘终端面积获得最大的阻断电压。测试制成的器件可获得的特定导通电阻为140mΩcm〜2,反向击穿电压为14 kV,泄漏电流为10μA,非常接近使用该器件计算的平行平面结的理论值漂移区参数100μm,浓度5×10〜(14)cm〜(-3)。拟议的设备获得了最高的Baliga品质因数(BFOM)5.6 GW / cm〜2。此外,使用I-V方法演示了提取的势垒高度与晶圆上的理想因子的分布。还详细研究了环间距和MGM-FLR端接区域对SiC器件反向阻断性能的影响。

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  • 来源
    《Superlattices and microstructures》 |2020年第2期|106381.1-106381.9|共9页
  • 作者单位

    State Key Laboratory of Electronic Thin Films and Integrated Devices University of Electronic Science and Technology of China Chengdu 610054 China Institute of Electronic and Information Engineering of UESTC in Guangdong Dongguan 523808 China;

    State Key Laboratory of Electronic Thin Films and Integrated Devices University of Electronic Science and Technology of China Chengdu 610054 China;

    State Key Laboratory of Advanced Power Transmission Technology Global Energy Interconnection Research Institute Beijing 102209 China;

    Microsystem and Terahertz Research Center China Academy of Engineering Physics Mianyang 621900 China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Silicon carbide; Ni-Schottky; MGM-FLR; Ultra-high voltage;

    机译:碳化硅;尼·肖特基MGM-FLR;超高压;

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