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The effect of low temperature AlN interlayers on the growth of GaN epilayer on Si (111) by MOCVD

机译:低温AlN中间层对MO(CVD)在Si(111)上GaN外延层生长的影响

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Low temperature (LT) AlN interlayers were used to effectively reduce the tension stress and micro-cracks on the surface of the GaN epilayer grown on Si (111) substrate. Optical Microscopy (OM), Atomic Force Microscopy (AFM), Surface Electron Microscopy (SEM) and X-Ray Diffraction (XRD) were employed to characterize these samples grown by metal-organic chemical vapor deposition (MOCVD). In addition, wet etching method was used to evaluate the defect of the GaN epilayer. The results demonstrate that the morphology and crystalline properties of the GaN epilayer strongly depend on the thickness, interlayer number and growth temperature of the LT A1N interlayer. With the optimized LT A1N interlayer structures, high quality GaN epilayers with a low crack density can be obtained.
机译:低温(LT)AlN中间层用于有效降低在Si(111)衬底上生长的GaN外延层表面上的拉应力和微裂纹。使用光学显微镜(OM),原子力显微镜(AFM),表面电子显微镜(SEM)和X射线衍射(XRD)来表征通过金属有机化学气相沉积(MOCVD)生长的样品。另外,使用湿蚀刻法来评估GaN外延层的缺陷。结果表明,GaN外延层的形貌和结晶特性强烈取决于LT AlN中间层的厚度,中间层数和生长温度。通过优化的LT AlN夹层结构,可以获得具有低裂纹密度的高质量GaN外延层。

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