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Investigation of indium-tin-oxide ohmic contact to p-GaN and its application to high-brightness GaN-based light-emitting diodes

机译:铟锡氧化物欧姆接触p-GaN的研究及其在高亮度GaN基发光二极管中的应用

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摘要

Indium-tin-oxide (ITO) contacts to p-GaN exhibit ohmic characteristics by inserting a 10-nm-thick p-In_(0.1)Ga_(0.9)N layer as an intermediate. The specific contact resistivity of 4.5 x 10~(-2) Ω cm~2 was obtained while annealing ITO/p-GaN contacts at 500℃. Based on the variation of contact resistivity with respect to temperature, the dominant transport mechanism of ITO/p-GaN structure tended from thermionic field emission to thermionic emission when the post-annealing temperature was raised from 400℃ to 600℃. From the XPS, XRD and SIMS results, the outdiffusion of gallium atoms and the formation of Ga-O bonds could introduce the gallium vacancies and increase the net concentration of holes, which would benefit the carrier tunneling through the interface. The GaN-based light-emitting diodes (LEDs) with 500℃-annealed ITO contacts exhibited the forward voltage of 3.43 V and output power of 4.30 mW at a 20-mA-current injection. Although the forward voltage showed a little higher than the conventional LEDs by 0.2 V, the external quantum efficiency and power efficiency were enhanced by about 46% and 36%, respectively. As for the life test, LEDs with 500℃-annealed ITO contacts presented a similar reliability as the conventional LEDs. Therefore, ITO contacts can make GaN-based LEDs highly bright and reliable in practice.
机译:通过插入厚度为10 nm的p-In_(0.1)Ga_(0.9)N层作为中间层,与p-GaN接触的氧化铟锡(ITO)表现出欧姆特性。在500℃下对ITO / p-GaN触点进行退火时,获得的比接触电阻率为4.5 x 10〜(-2)Ωcm〜2。基于接触电阻率随温度的变化,当退火温度从400℃升高到600℃时,ITO / p-GaN结构的主要传输机理从热电子场发射变为热电子发射。根据XPS,XRD和SIMS结果,镓原子的扩散和Ga-O键的形成可能会引入镓空位并增加空穴的净浓度,这将有利于载流子穿过界面隧穿。具有500℃退火ITO触点的GaN基发光二极管(LED)在注入20 mA电流时表现出3.43 V的正向电压和4.30 mW的输出功率。尽管正向电压显示出比常规LED高0.2 V,但外部量子效率和功率效率分别提高了约46%和36%。至于寿命测试,具有500℃退火ITO触点的LED的可靠性与传统LED相似。因此,ITO触点可以在实践中使GaN基LED高亮度和高可靠性。

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