首页> 外文期刊>IEEE Journal of Solid-State Circuits >A 31.3-dBm Bulk CMOS T/R Switch Using Stacked Transistors With Sub-Design-Rule Channel Length in Floated p-Wells
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A 31.3-dBm Bulk CMOS T/R Switch Using Stacked Transistors With Sub-Design-Rule Channel Length in Floated p-Wells

机译:一个31.3 dBm批量CMOS T / R开关,使用堆叠式晶体管,在浮动p阱中具有子设计规则通道长度

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摘要

A 31.3-dBm 900-MHz bulk CMOS T/R switch with transmit (TX) and receive (RX) insertion losses of 0.5 and 1.0 dB and isolation of 29 dB is demonstrated. The switch utilizes a floating-body technique, feed-forward capacitors, and 3-stack 3.3-V MOSFETs with 0.26- $mu{hbox {m}}$ sub-design-rule (SDR) channel length. Using these, a 28-dBm 2.4-GHz T/R switch with TX and RX insertion losses of 0.8 and 1.2 dB, and isolation of 24 dB is also demonstrated. The power handling capability is limited by an abrupt output power drop before reaching the normal 1-dB compression point. The circuits are implemented in the UMC 130-nm mixed-mode triple-well CMOS process.
机译:演示了一种31.3 dBm 900 MHz批量CMOS T / R开关,其发射(TX)和接收(RX)插入损耗分别为0.5和1.0 dB,隔离度为29 dB。该开关采用浮体技术,前馈电容器和具有0.26 µmu {hbox {m}} $子设计规则(SDR)沟道长度的3叠3.3V MOSFET。使用这些,还演示了28-dBm 2.4 GHz T / R开关,TX和RX的插入损耗分别为0.8和1.2 dB,隔离度为24 dB。功率处理能力受到在达到正常1dB压缩点之前突然下降的输出功率的限制。这些电路以UMC 130纳米混合模式三阱CMOS工艺实现。

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