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Compact Thermal-Diffusivity-Based Temperature Sensors in 40-nm CMOS for SoC Thermal Monitoring

机译:用于SoC热监测的40nm CMOS紧凑型基于热扩散率的温度传感器

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An array of temperature sensors based on the thermal diffusivity (TD) of bulk silicon has been realized in a standard 40-nm CMOS process. In each TD sensor, a highly digital voltage-controlled oscillator-based ΣΔ ADC digitizes the temperature-dependent phase shift of an electrothermal filter (ETF). A phase calibration scheme is used to cancel the ADC’s phase offset. Two types of ETF were realized, one optimized for accuracy and one optimized for resolution. Sensors based on the accuracy-optimized ETF achieved a resolution of 0.36 °C (rms) at 1 kSa/s, and inaccuracies of ±1.4 °C (3 σ , uncalibrated) and ±0.75 °C (3 σ , room-temperature calibrated) from −40 °C to 125 °C. Sensors based on the resolution-optimized ETFs achieved an improved resolution of 0.21 °C (rms), and inaccuracies of ±2.3 °C (3 σ , uncalibrated) and ±1.05 °C (3 σ , room-temperature calibrated). The sensors draw 2.8 mA from supply voltages as low as 0.9 V, and occupy only 1650 μm2 , making them some of the smallest smart temperature sensors reported to date, and well suited for thermal monitoring applications in systems-on-chip.
机译:基于体硅热扩散率(TD)的温度传感器阵列已通过标准的40纳米CMOS工艺实现。在每个TD传感器中,高度数字化的基于压控振荡器的ΣΔADC将电热滤波器(ETF)随温度变化的相移数字化。相位校准方案用于消除ADC的相位偏移。实现了两种类型的ETF,一种针对精度进行了优化,另一种针对分辨率进行了优化。基于精度优化的ETF的传感器在1 kSa / s时达到0.36°C(rms)的分辨率,并且精度为±1.4°C(3σ,未校准)和±0.75°C(3σ,室温校准) )从−40°C到125°C。基于分辨率优化的ETF的传感器实现了0.21°C(rms)的改进分辨率,以及±2.3°C(3σ,未校准)和±1.05°C(3σ,室温校准)的精度。这些传感器从低至0.9 V的电源电压汲取2.8 mA电流,仅占用1650μm2的面积,使其成为迄今为止报道的最小的智能温度传感器之一,非常适合片上系统的热监控应用。

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