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lndication of velocity overshoot in strained Si_0.8Ge_0.2 p-channel MOSFETs

机译:应变Si_0.8Ge_0.2 p沟道MOSFET中的速度超调指示

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A velocity--field study of several Si_0.8Ge_0.2/Si p-channel MOSFETs with self-aligned poly-Si gates, thick gate oxides and effective channel lengths ranging from 1.5 to 8.5 μm, was carried out at room temperature. Comprehensive two-dimensional simulations of devices using drift--diffusion (DD), and bulk Monte Carlo calibrated hydrodynamic (HD) and energy transport (ET) models have revealed enhanced high-field hole transport in strained-channel MOSFETs. A close agreement is obtained between higher-level (HD/ET) models and DD model with calibrated high-field mobility parameters. It is found that the relatively low value of extracted saturation velocity in long-channel Si_0.8Ge_0.2 p-MOSFETs increases considerably as the gate length is decreased. The increase in short-channel samples is attributed to non-equilibrium transport effects in the region near the source, resulting from higher mobility and longer relaxation times of holes in the strained SiGe layer Our results not only confirm the expected advantage of strained SiGe p-MOSFETs in low-field transport, but also indicate that this is accompanied by an early onset of velocity overshoot, which may be beneficial in aggressively scaled devices.
机译:在室温下对几种具有自对准多晶硅栅极,厚栅极氧化物和有效沟道长度为1.5至8.5μm的Si_0.8Ge_0.2 / Si p沟道MOSFET进行了速度场研究。使用漂移扩散(DD)以及整体蒙特卡洛校准流体力学(HD)和能量传输(ET)模型的器件的全面二维仿真显示,应变沟道MOSFET的高场空穴传输得到了增强。在具有校准的高场迁移率参数的更高级别(HD / ET)模型和DD模型之间获得了密切的一致性。已经发现,随着栅极长度的减小,长沟道Si_0.8Ge_0.2 p-MOSFET中提取的饱和速度的相对较低的值显着增加。短通道样品的增加归因于在源附近区域的非平衡传输效应,这是由于应变SiGe层中空穴的迁移率更高和弛豫时间更长而导致的。我们的结果不仅证实了应变SiGe p-低场输运中的MOSFET也表明,这会伴随着速度过冲的尽早出现,这在积极扩展器件中可能是有益的。

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