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Gas-source molecular beam epitaxy of SiGe virtual substrates: II. Strain relaxation and surface morphology

机译:SiGe虚拟衬底的气源分子束外延:II。应变松弛和表面形态

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We have studied the strain state, film and surface morphology of SiGe virtual substrates grown by gas-source molecular beam epitaxy (use of disilane and germane). The macroscopic strain relaxation and the Ge composition of these virtual substrates have been estimated in high resolution x-ray diffraction, using either omega-2 theta scans or reciprocal space maps around the (004) and (224) orders. Typically, linearly graded Si_0.67Ge_0.33 virtual substrates 2.5 μm thick are 97/100 relaxed. From transmission electron microscopy, we confirm that the misfit dislocations generated to relax the lattice mismatch between Si and SiGe are mostly confined inside the graded layer. The surface roughness of the relaxed SiGe virtual substrates increases significantly as the Ge concentration and/or the growth temperature exceeds 20/100 /600 ℃. At 550 ℃, we find for the technologically important Ge concentration of 30/100 a surface root mean square roughness of 12 nm, with an undulation wavelength for the cross-hatch of the order of one micron.
机译:我们研究了通过气源分子束外延生长(使用乙硅烷和锗烷)生长的SiGe虚拟衬底的应变状态,薄膜和表面形态。使用omega-2 theta扫描或(004)和(224)阶的倒数空间图,可以通过高分辨率x射线衍射估算这些虚拟基板的宏观应变弛豫和Ge组成。通常,线性渐变2.5微米厚的Si_0.67Ge_0.33虚拟衬底具有97/100松弛度。从透射电子显微镜,我们确认所产生的失配位错主要被限制在渐变层内,该失配位错是为了缓解Si和SiGe之间的晶格失配而产生的。随着Ge浓度和/或生长温度超过20/100 / 600℃,松弛的SiGe虚拟衬底的表面粗糙度显着增加。在550℃时,我们发现具有重要技术意义的Ge浓度为30/100,表面均方根粗糙度为12 nm,交叉影线的起伏波长约为1微米。

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