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Annealing of Schottky contacts deposited on dry etched AlGaN /GaN

机译:干法刻蚀的AlGaN / GaN上沉积的肖特基接触点的退火

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摘要

The influence of annealing on properties of Pt Schottky contacts deposited on the electron cyclotron resonance plasma etched surface of an AlGaN/GaN heterostructure has been investigated. It is found that rapid Thermal annealing (450 deg. C and 40 s in nitrogen gas), performed after metal Deposition, allows for the preparation of Schottky contacts with similar or Better properties than those obtained on a non-etched surface. This Procedure is suitable for the realization of recessed high-quality Schottky Contacts of AlGaN/GaN HEMTs.
机译:研究了退火对沉积在AlGaN / GaN异质结构的电子回旋共振等离子体刻蚀表面上的Pt肖特基接触的性能的影响。已经发现,在金属沉积之后进行的快速热退火(在氮气中450℃和40 s)可以制备出与未蚀刻表面上具有相似或更好性能的肖特基接触。该程序适用于实现AlGaN / GaN HEMT的凹陷高质量肖特基接触。

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