Flip-Chip Packaging Moves into the Mainstream

摘要

Flip-chip offers improved thermal and electrical performance, as, welt as reduced form factors compared with wire-bond packaging, Originally introduced by IBM more than 30 years ago, flip-chip packaging is by no means a new technology. But until recently, flip-chip technology has been restricted to high-end devices and niche applications. Today, demand for flip-chip packaging is on the rise, as the technology is being embraced for a broader range of applications and implemented in a wider variety of package types. At the same time, flip-chip presents manufacturers with a new array of challenges, making it critical for them to leverage the expertise of back-end subcontractors to provide packaging, assembly and test services for this complex technology.