Minimum Area Required for Poly Etch Endpoint Detection

摘要

Endpoint detection used in plasma etching is a very important process control technique. It is a method that identifies when the film of interest has been removed. Detecting the endpoint, by design, ensures a consistent amount of etch on each wafer. Endpoint detection prevents under-etching caused by low etch rates or thick incoming films and over-etching caused by high etch rates or thin incoming films.