TSMC VP Discusses 90 nm Interconnect Issues

摘要

Built-in performance, reliability and manufacturability best describe TSMC's approach to the future, according to Shang-Yi Chiang, senior vice president of R&D at TSMC (Hsinchu, Taiwan), who gave the keynote speech at the International Interconnect Technology Conference (IITC) last month. In his talk, Chiang detailed some of the changes for the 90 nm device generation, but also some of the lessons learned regarding yield ramping and time to market. "You have to find as many resources as you can to solve problems more quickly. The best way to do this is to collaborate with people of different disciplines throughout the whole supply chain, including product design, library/IP, TCAD, technology, equipment and assembly." He emphasized that, without a close collaboration, problems will not be solved in a timely manner and will end up costing the company dearly if prod- ucts cannot be marketed on time.