Emerging SOTs Shrink Size and Boost Thermal Performance

摘要

In the quest for smaller-outline semiconductor packages, a compromise between size and performance is usually required. However, on occasion, an outline is found that achieves size-reduction goals without sacrificing performance, and therefore gains rapid market acceptance for design into next-generation products. Such is the case for newer small-outline transistor (SOT) plastic packages - SOT553 and SOT563. Combining a smaller PCB footprint with a lower-height profile, these emerging packages are increasingly finding homes in a wide variety of portable equipment and other applications where space and weight are at a premium. While a smaller component size typically equates to lower power dissipation, with SOT553/563, thermal performance is improved by >40% over SC88 and other larger packages. This is due to the implementation of specific design impera-ternal leadframe designs.