Wafer Backside

摘要

In wafer backside coating, the adhesive is supplied as a paste, which is applied to the back of a wafer and dried. Advantages include a 2O-30% cost reduction compared with film, control of bond-line thickness and higher throughput. For decades, the semiconductor industry has used adhesive pastes to attach die to leadframes and other substrates. Typically, adhesive has been dispensed through needles from syringes or, for smaller dots, applied by the pin-transfer method. Some manufacturers, notably in the automotive hybrid industry, have applied adhesive by screen printing.