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Reconditioning of substrate support by means of a annular coated substrate

机译:通过环形涂覆的基材来修复基板支撑件

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This research disclosure relates to a substrate and a method for reconditioning a substrate support. Especially, it is related to reconditioning of protrusions, or burls, at the outer side of the a substrate support, by means of a thin film provided at a substrate backside arranged in an annular arrangement. Substrate supports, e.g., wafer tables, arc workpicccs consisting of a body material, which is typically provided with a plurality of protrusions, also called burls. The primary function of the substrate support and the burls is to support a substrate. Typically, the top-surfaces of the burls are configured with a nano-roughncss to minimize the impact of friction between the substrate and the burls, which is beneficial for overlay performance. During use, the substrate support is exposed to fluids, e.g., rinsing and or immersion liquids, and interacts with the backside of the substrates loaded onto the substrate support. Herewith, the nano-roughness on top of the burls is slowly smoothed away with every wafer load and unload, and diminishing the lifetime of the substrate support dramatically.
机译:该研究公开涉及基板和用于修复基板支撑的方法。特别地,借助于设置在以环形布置的基板背面的薄膜在基板支撑件的薄膜上,突出的突起或爆破的突起和脉冲的修复有关。基板支撑件,例如晶片表,由主体材料组成的弧形工作组件,其通常设置有多个突起,也称为毛刺。基板支撑和脉冲的主要功能是支撑衬底。通常,脉冲的顶表面配置有纳米粗糙度,以最小化摩擦在基板和毛刺之间的影响,这是有利于覆盖性能的有益的。在使用期间,基板支撑件暴露于流体,例如漂洗和或浸入液体,并与装载到基板支架上的基板的背面相互作用。在此,毛刺顶部的纳米粗糙度与每个晶片载荷和卸载缓慢地滑动,并急剧下调基板支撑件的寿命。

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    《Research Disclosure》 |2020年第676期|1428-1429|共2页
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