首页> 外国专利> Annular glass substrate, method for producing annular glass substrate, method for producing annular glass substrate, and method for producing glass substrate for magnetic disk

Annular glass substrate, method for producing annular glass substrate, method for producing annular glass substrate, and method for producing glass substrate for magnetic disk

机译:环形玻璃基板,环形玻璃基板的制造方法,环形玻璃基板的制造方法以及磁盘用玻璃基板的制造方法

摘要

A process for forming an annular glass blank from a plate-shaped glass blank, wherein on a main surface of the plate-shaped glass blank: a first circular blade is turned along the main surface at a first turning radius to form an outside incision; and a second circular blade is turned along the main surface at a second turning radius that is smaller than the first turning radius to form an inside incision. A plurality of first cutouts are provided to the cutting edge of the first circular blade so as to be set apart from each other in the circumferential direction by a first spacing, and a plurality of second cutouts are provided to the cutting edge of the second circular blade so as to be set apart from each other in the circumferential direction by a second spacing. The first spacing is smaller than the second spacing. The concentricity between the inner peripheral end surface and the outer peripheral end surface of the annular glass blank is 15 μm or less. The difference between the roundness of the outer peripheral profile of a first main surface of the annular glass blank and the roundness of the outer peripheral profile of a second main surface, which is located on the reverse side from the first main surface, is 100 μm or less.
机译:一种由板状玻璃坯料形成环形玻璃坯料的方法,其中在该板状玻璃坯料的主表面上:第一圆形刀片沿该主表面以第一转动半径转动以形成外切口;第二圆形刀片沿主表面以小于第一转弯半径的第二转弯半径旋转以形成内部切口。多个第一切口设置在第一圆形刀片的​​刀刃上,以在圆周方向上彼此隔开第一间隔,并且多个第二切口设置在第二圆形刀片的​​刀刃上。叶片在圆周方向上彼此间隔开第二间隔。第一间隔小于第二间隔。环状玻璃坯料的内周端面与外周端面之间的同心度为15μm以下。环形玻璃毛坯的第一主表面的外周轮廓的圆度与位于与第一主表面相反的一侧的第二主表面的外周轮廓的圆度之间的差为100μm。或更少。

著录项

  • 公开/公告号JP6385595B2

    专利类型

  • 公开/公告日2018-09-05

    原文格式PDF

  • 申请/专利权人 HOYA株式会社;

    申请/专利号JP20170559253

  • 发明设计人 東 修平;

    申请日2016-12-28

  • 分类号G11B5/84;G11B5/73;

  • 国家 JP

  • 入库时间 2022-08-21 13:08:35

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号