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Tool for reconditioning a substrate support

机译:修复基板支架的工具

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This research disclosure relates to a tool and a method for reconditioning a substrate support. Especially, it is related to reconditioning of protrusions, or burls, at a surface of the a substrate support. Substrate supports, e.g., wafer tables, are workpieces consisting of a body material, which is typically provided with a plurality of protrusions, also called burls. The primary function of the substrate support and the burls is to support a substrate. Typically, the top-surfaces of the burls are configured with a nano-roughness to minimize the impact of friction between the substrate and the burls, which is beneficial for overlay performance when used in a lithographic apparatus. During use, the substrate support may be exposed to fluids, e.g., rinsing and or immersion liquids, and interacts with the backside of the substrates loaded onto the substrate support. Herewith, the nano-roughncss on top of the burls is slowly smoothed away with every wafer load and unload, and diminishing the lifetime of the substrate support dramatically.
机译:该研究公开涉及一种用于修复基板支撑件的工具和方法。特别地,它与突起或突然的修复有关,在基板支撑件的表面处。基板支撑件,例如晶片表,是由主体材料组成的工件,其通常设置有多个突起,也称为毛刺。基板支撑和脉冲的主要功能是支撑衬底。通常,脉冲的顶表面配置有纳米粗糙度,以最小化摩擦在基板和毛刺之间的影响,这对于在光刻设备中使用时是有益的覆盖性能。在使用期间,基板支撑件可以暴露于流体,例如冲洗和或浸入液体,并与装载到基板支撑件上的基板的背面相互作用。在此,在毛刺顶部的纳米粗糙度与每个晶片负载和卸载缓慢地平滑,并急剧下调基板支撑件的寿命。

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    《Research Disclosure》 |2021年第681期|244-247|共4页
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