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A performance/cost approach to transistor design

机译:晶体管设计的性能/成本方法

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摘要

The customer is interested in the overall performance and the cost of transistors and this requires a more sophisticated design approach aimed at high performance at low cost. For the high-frequency high-power market, the transistor designer is technically limited in his choice of junction formation methods, and the cost of products is high. For those markets where many techniques compete, the performance/cost design approach is essential; the low-frequency low-power market particularly warrants this approach at this time. For the low-frequency low-power market, where several techniques can yield the same performance, the designer must consider the various methods of forming junctions and making contacts, and the mechanical design, including the housing, in terms of the cost factors. The various design elements will be described and analysed with respect to the cost factors reflected by process complexity, product reproducibility and design flexibility. Particular emphasis is placed on a comparison of the three basic junction-formation techniques¿alloy, grown and diffused. This analysis indicates, on a performance/cost basis, that alloy and grown types of transistors have, and will have for many years, an important share of the computer, audio and broadcast radio-frequency and intermediate-frequency markets. Consideration of the high-frequency high-power markets, and the inevitable simplification of the relatively new diffusion process, leads to the conclusion that all three basic techniques will be required to obtain the broadest market coverage in the expanding transistor market.
机译:客户对晶体管的整体性能和成本感兴趣,因此需要一种更复杂的设计方法,以低成本实现高性能。对于高频大功率市场,晶体管设计者在选择结形成方法时在技术上受到限制,并且产品成本很高。对于许多技术竞争的市场,性能/成本设计方法至关重要。低频低功率市场目前特别需要这种方法。对于低频低功率市场,在其中几种技术可以产生相同的性能,设计人员必须在成本因素方面考虑形成结点和形成触点的各种方法,以及包括外壳的机械设计。将针对过程复杂度,产品可重复性和设计灵活性所反映的成本因素,描述和分析各种设计元素。特别强调的是对三种基本的结点形成技术-合金,生长和扩散的比较。从性能/成本的角度出发,该分析表明合金和增长类型的晶体管已经并且将在计算机,音频和广播射频和中频市场中占有很大份额。考虑到高频大功率市场以及相对较新的扩散过程的必然简化,得出的结论是,在不断扩大的晶体管市场中,要获得最广泛的市场覆盖率,必须使用所有三种基本技术。

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