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Growing, Growing ... Gone

机译:成长中,成长中...消失了

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摘要

2001 was a disaster for almost every PCB manufacturer. Or, perhaps we could say, 2000 was too good. But last year, volume reduction and price erosion affected most companies' performance. Mobile phones and base-stations performed extremely poorly, yet IT infrastructure was hardest hit. Many dot-coms ordered networking equipment far in excess of what was needed, then collapsed, causing a chain reaction among equipment suppliers (Cisco, Nortel, Lucent, Alcatel, Siemens, NEC, and Fujitsu, to name a few). As a result, revenues of their major PCB and EMS suppliers dropped considerably. Demand for small-outline BGA and chip-scale packages, of which five to eight units are used in mobile phones, suffered as well. An estimated 500 million mobile phones were produced in 2000; about 410 million units were sold. The extra 90 million units overflowed into 2001, while demand fell to about 300 million units, resulting in a 40 to 50% reduction in CSP production. The fall also precipitated a 40% plunge in resin-coated foil sales because RCF is primarily used in microvia boards for handsets.
机译:2001年几乎是所有PCB制造商的灾难。或者,也许可以说,2000年太好了。但是去年,数量减少和价格下降影响了大多数公司的业绩。手机和基站的性能极差,但IT基础架构受到的打击最大。许多网络公司订购的网络设备远远超出了需要的数量,然后崩溃了,导致设备供应商之间的连锁反应(思科,北电,朗讯,阿尔卡特,西门子,NEC和富士通等)。结果,其主要的PCB和EMS供应商的收入大幅下降。对于小型外形BGA和芯片级封装的需求也受到了影响,其中五到八个单元用于手机。 2000年估计生产了5亿部手机;售出约4.1亿部。额外的9000万台产品溢出到2001年,而需求下降到大约3亿台,导致CSP生产减少了40%到50%。下降还促使树脂涂层箔的销售下降了40%,因为RCF主要用于手机的微孔板。

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