Can Existing Tools Survive Lead-free Soldering?

摘要

In the transition to lead-free soldering, an area of concern in assembly operations is what equipment changes, if any, will be needed for lead-free elec- tronics assembly processes. SnAgCu (or SAC), the most common lead-free solder alloy, has a higher melting point than SnPb solder, which increases the thermal demands on certain processing equipment. There are also concerns about mixing SnPb and lead-free soldering operations and whether dedicated equipment is necessary to avoid contamination.