Often, In an effort to increase throughput, anode/ cathode spacing is reduced and plating uniformity suffers. Increasing the anode to cathode distance minimizes platingrnvariations. FIGURE 1 illustrates the effect of anode to cathode distance.rnAnode surface area versus cathode surface area is another important consideration. If the anodes are much larger in area than the cathode, increased current flow around the edges of the panels (cathode) will be plated to a much greater thickness than other areas, as depicted in FIGURE 2. Pattern plating of PCBs represents a similar situation.rnTo minimize the primary current distribution, it is recommended that anode to cathode surface area ratios should not exceed 2:1 and anode length should be three to six inches shorter than the cathode. Rack design and cathode spacing on the rack will also influence the primary current distribution.
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