Design And Fab Tipsfor Improving Solder Mask Registration

摘要

The evolution of surface mount technology (SMT) is toward the use of smaller and higher I/O components for new electronics applications, including portable and hand-held products. This drives a need to reduce size and increase interconnect density for new area array packages. The assembly process for ball-grid array (BGA) and chip-scale packages (CSP) has stabilized over the years. However, products using fine-pitch BGA/ CSP components at 0.8-mm pitch or below still pose many assembly challenges, including solder short prevention and detection.