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Vias in BGA Pads

机译:BGA焊盘中的过孔

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The answer to the question "Is it ever okay to put open vias in BGA pads?" is simply "no." It's no, no, no, no, not ever!!! That makes it easy. No technique to worry about. No tolerances. Nothing. Just don't put an exposed via in a BGA pad. The only option is between the pads, with a complete solder mask dam between the pad and via, or have the vias filled and plated over at the board house. It doesn't matter if the BGA is sub-millimeter pitch or larger-than-millimeter pitch. Nothing but metal is allowed on the BGA pad. Now, other components offer more flexibility and thus require some choices and guidelines. Reader Andy B. asked about large components, such as voltage regulators, where the manufacturer has recommended vias to connect the thermal pad to the ground plane, or to additional thermal area on the back side of the PCB.
机译:这个问题的答案“在BGA焊盘上放开通孔是否还可以?”简直是“不”。这是不,不,不,不,从来没有!!!这很容易。无需担心。没有公差。没有。只是不要在BGA焊盘上放置裸露的过孔。唯一的选择是在焊盘之间,在焊盘和通孔之间具有完整的阻焊层,或者在板房中填充并电镀通孔。 BGA是小于毫米的节距还是大于毫米的节距都没关系。 BGA焊盘上不允许有金属。现在,其他组件提供了更大的灵活性,因此需要一些选择和准则。读者Andy B.询问了诸如稳压器之类的大型组件,制造商建议在其中使用过孔将散热垫连接至接地层,或连接至PCB背面的额外散热区域。

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