HALOGEN-FREE INTEPOSER LAMINATE

摘要

Mcl-E-800G/MCL-E-705G series semiconductor package substrate materials are halogen-free, high Tg, low thermal expansion. 800G series has a CTE of 2.8ppm/℃, and is for use in PoP and FC-BGA interposer substrates. MCL-E-705G series is suitable for multi-tiered structures such as stacked packages.