New 3M Substrate Enables Adhesiveless LED Chip Package

摘要

Austin, tx - 3M Electronics Materials launched a copper-polyimide substrate designed to hold LED chips without adhesive. In the new design, the LED chip sits directly on top of a large copper conduit area held by a polyimide frame. An alternative to ceramic substrates, the substrate is constructed of copper and polyimide, and is said to meet the electrical and thermal performance required of high-power LED chips. It comes in tray-and-reel format.