Fan-out wafer-level packaging (FO-WLP) technology has picked up considerable momentum since it was selected by Apple for use in the iPhone 7. FO-WLP establishes die-to-die and die-to-ball grid array (BGA) connectivity directly through packaging redistribution layers (RDLs), eliminating the packaging substrate used in more-established flip-chip and wafer-level chip scale packages (WLCSP). The advantages of FO-WLP include the ability to support more I/O, a smaller vertical footprint that often makes it possible to reduce product form factor or stack more components, a reduction in costs by eliminating the interposer and insertion of through-silicon vias (TSVs), and improvements in electrical and thermal performance because the transistors drive less metal length.
展开▼
