SUCCESSFULLY implemented on flex and rigid-flex every day. Standard through-hole constructions are the most cost-effective, but in some cases there is no room for through-holes and their larger pad diameters. Via-in-pad is a design strategy that may be required with very tight pitch BGA components and other SMT devices on flex and rigid-flex. The advantage of using a microvia is the hole size is quite small, and the associated pad is small as well. This provides more real estate for routing signals, especially out of BGA patterns. The rules-of-thumb and considerations are different, however, depending on whether the part is purely flex or rigid-flex.
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