Samsung Develops First 12-Layer 3D-TSV Chip Packaging Technology

摘要

SEOUL - Samsung Electronics in October announced it has developed the industry's first 12-layer 3D-TSV (through-silicon via) technology. The innovation, which is used for mass production of high-performance chips, requires pinpoint accuracy to vertically interconnect 12 DRAM chips through a three-dimensional configuration of more than 60,000 TSV holes, each of which is one-twentieth the thickness of a single strand of human hair.