Understanding and Eliminating Mid-Chip Solder Balls

摘要

WHILE THE PRIMARY theme of this column over the past few years has been miniaturization's impact on stencil printing, standard SMT process challenges are alive and well. In many applications, where average device dimensions are large compared to the latest package footprints, reducing traditional defects is still a battle. One such frustration: mid-chip solder balls. To understand how to correct this well-known defect, one must appreciate the origin.