SOLDER BALL ELIMINATING METHOD AND ROTARY BRUSH APPARATUS USED IN SAID ELIMINATION

摘要

PURPOSE: To obtain a method for eliminating solder balls which adhere to a mounting surface when a circuit parts is surfacemounted on a printed wiring board, and a solder ball eliminating means without using fluorocarbon based solvent, regarding a rotary brush apparatus used at the time of eliminating solder balls. ;CONSTITUTION: A printed wiring board 1 is heated at a specified temperature higher than the softening temperature of flux and lower than the melting temperature of solder. The mounting surface 1A of the printed wiring board 1 is scrubbed with a brush 12, and the air on the region of the scrubbed mounting surface 1A is sucked, thereby peeling and sucking solder balls 7 which have adhered to the mounting surface 1A.;COPYRIGHT: (C)1993,JPO&Japio