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Na Incorporation in Cu(In,Ga)(Se,S)2 Films Grown on Insulator-Coated Stainless Steel Foil Using a Metal Precursor Reaction

机译:通过金属前驱体反应,在绝缘体涂覆的不锈钢箔上生长的Cu(In,Ga)(Se,S) 2 膜中掺入Na

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摘要

Cu(In,Ga)(Se,S) (CIGSS) films are formed on flexible 430 stainless steel foils through reacting Cu–In–Ga metal precursors in HSe and HS. The foils are coated using an electrically insulating silicone-based resin that can sustain temperatures as high as 600 °C. NaF films with various thicknesses are deposited between the metal precursor and Mo back contact in order to incorporate Na into the CIGSS films. The metal precursor reaction with the extrinsic Na incorporation results in greater Ga homogenization and S incorporation. The higher Na incorporation enhances and lowers . The temperature-dependent and drive-level capacitance profiling measurements reveal that the Na incorporation results in higher activation energy of the recombination and increased carrier density.
机译:通过在HSe和HS中使Cu-In-Ga金属前体反应,在柔性430不锈钢箔上形成Cu(In,Ga)(Se,S)(CIGSS)膜。箔使用可以维持高达600°C的温度的电绝缘硅酮树脂涂覆。将各种厚度的NaF膜沉积在金属前驱体和Mo背接触之间,以将Na掺入CIGSS膜中。金属前驱物与外在Na的结合导致更大的Ga均匀化和S的结合。较高的Na掺入量会增加和降低。温度相关的和驱动级的电容分布测量结果表明,Na的掺入会导致重组的活化能更高,并且载流子密度也会增加。

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