QFP (Quad Flat Package) is used in situations requiring higher density, narrower lead pitch and thinner substrates for surface mounting. Then, more QFP leads are needed to provide more advanced functions and higher densities of electronic devices. Lead pitch for QFP is generally 0.5mm (lead pitch 0.3mm is the minimum size that can be mounted). QFP mounting and QFP lead quality assurance are more difficult if the lead pitch is narrower and there are more leads.
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