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Fabrication of vertical channel top contact organic thin film transistors

机译:垂直沟道顶部接触有机薄膜晶体管的制造

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Vertical channel top contact (TC) organic thin film transistors (OTFTs) have been successfully realized on Si substrates with SiO_2 as gate insulators and P3HT(poly ~3-hexylthiophene) as organic semiconductors. The active channel region was defined by a steep step through a Si etching method. Source and drain metal contacts were deposited by vacuum evaporation through a shadow mask at a high tilting angle. Top contact transistors with channel lengths 5 μrn can be fabricated with a relatively simple and efficient (yield > 85%) fabrication process with only two photolithography steps (two photo masks) while no need for high-resolution and precision alignment for channel definition. Measurement results showed that the vertical channel BC (bottom contact) devices have compatible performance with planar BC devices. However, vertical channel TC transistors showed improved performance with double field effect mobilities and three times larger current ON/OFF ratios than vertical channel BC devices.
机译:在以SiO_2为栅绝缘体,以P3HT(poly〜3-hexylthiophene)为有机半导体的Si衬底上,成功实现了垂直沟道顶接触(TC)有机薄膜晶体管(OTFT)的发展。通过硅蚀刻方法的陡峭步骤来限定有源沟道区。源极和漏极金属触点通过真空蒸发通过荫罩以高倾斜角沉积。只需两个光刻步骤(两个光掩模),就可以用相对简单而有效的制造工艺(沟道长度为5μm)制造顶部接触晶体管,而无需进行高分辨率和精确对准即可定义沟道。测量结果表明,垂直通道BC(底部接触)器件具有与平面BC器件兼容的性能。但是,垂直沟道TC晶体管的性能提高了,场效应迁移率提高了两倍,电流开/关比是垂直沟道BC器件的三倍。

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