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机译:具有背面补偿层的薄型混合像素组件制造开发
Experimental Panicle Physics Croup, SUPA School of Physics and Astronomy, The University of Glasgow, Glasgow G12 8QQ, UK;
Experimental Panicle Physics Croup, SUPA School of Physics and Astronomy, The University of Glasgow, Glasgow G12 8QQ, UK;
Experimental Panicle Physics Croup, SUPA School of Physics and Astronomy, The University of Glasgow, Glasgow G12 8QQ, UK;
Experimental Panicle Physics Croup, SUPA School of Physics and Astronomy, The University of Glasgow, Glasgow G12 8QQ, UK;
Experimental Panicle Physics Croup, SUPA School of Physics and Astronomy, The University of Glasgow, Glasgow G12 8QQ, UK;
Experimental Panicle Physics Croup, SUPA School of Physics and Astronomy, The University of Glasgow, Glasgow G12 8QQ, UK;
CEA Leti, M1NATEC, 17 rue des Martyrs, F380S4, Grenoble, France;
CEA Leti, M1NATEC, 17 rue des Martyrs, F380S4, Grenoble, France;
CEA Leti, M1NATEC, 17 rue des Martyrs, F380S4, Grenoble, France;
Advacam Oy, Tietotie 3, 02150 Espoo, Finland;
Pixel detector; Silicon sensor; Pixel assembly; Thin readout chip;
机译:开发用于薄像素模块的3D组装的应力补偿层
机译:旋转自组装法制备聚合物/纳米粘土杂化超薄多层膜及其表征
机译:CDSE / ZnS芯/壳量子 - 点模板和杂交有机/无机发光二极管的制造和光学性能通过使用层逐层组装法
机译:薄像素模块3D组件的应力补偿层的开发
机译:第一部分:铂纳米粒子的原位脉冲电化学沉积,用于燃料电池中催化剂的有效利用。第二部分:使用逐层自组装法制备和表征聚电解质-量子点混合结构。
机译:通过在红细胞模板上的逐层组装来制造氧化石墨烯/聚电解质杂化胶囊
机译:用于混合像素检测器应用的变薄芯片的倒装芯片组件