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Comparison of 35 and 50 μm thin HPK UFSD after neutron irradiation up to 6 • 10~(15) neq/cm~2

机译:中子辐照后35和50μm薄HPK UFSD的比较高达6•10〜(15)Neq / cm〜2

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摘要

We report results from the testing of 35 mu m thick Ultra-Fast Silicon Detectors (UFSD) produced by Hamamatsu Photonics (HPK), Japan and the comparison of these new results to data reported in a previous paper on 50 mu m thick UFSD produced by HPK. The 35 mu m thick sensors were irradiated with neutrons to fluences of 1.10(14), 1.10(15), 3.10(15), 6.10(15) neq/cm(2). The sensors were tested pre-irradiation and post-irradiation with minimum ionizing particles (MIPs) from a Sr-90 beta-source. The leakage current, capacitance, internal gain and the timing resolution were measured as a function of bias voltage at -20 degrees C and -27 degrees C. The timing resolution was extracted from the time difference with a second calibrated UFSD in coincidence, using the constant fraction discrimination method for both devices. Within the fluence range measured, 35 mu m thick UFSD present advantages in timing accuracy, bias voltage and power consumption.
机译:我们报告了由Hamamatsu Photonics(HPK),日本生产的35 Mu M厚的超快速硅探测器(UFSD)的测试结果,以及这些新结果与上一篇文章中报告的数据的比较,以50 mu M厚的UFSD HPK。将35μm厚的传感器用中子照射到1.10(14),1.10(15),3.10(15),6.10(15)Neq / cm(2)的流量。通过SR-90β源的最小电离颗粒(MIPS)测试传感器预辐射和后照射。测量漏电流,电容,内部增益和定时分辨率作为-20°C和-27摄氏度的偏置电压的函数。用第二校准的UFSD在巧合的时间差中提取定时分辨率,使用两种设备的恒定分数辨别方法。在测量的流量范围内,35亩厚的UFSD在定时精度,偏置电压和功耗下存在优点。

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