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Fibre Bragg Gratings to monitor the deformations of a silicon microstrip vertex detector

机译:光纤布拉格光栅可监控硅微带顶点检测器的变形

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An important issue concerning tracking detectors is that they undergo deformations, which, if not negligible, may worsen the detector intrinsic resolution. The objective of this paper is to assess the accuracy of Fibre Bragg Grating (FBG) technology to monitor the deformations of a silicon microstrip detector under stationary thermal conditions. For this purpose, a detector module was employed, of the same type as those composing the vertex detector of the FINUDA apparatus at DAΦNE. Two bare FBG sensors were glued close to the border of the silicon microstrip detectors and their responses were compared with the responses of two CCD laser displacement sensors over a time period of 24 days. A calibration method to determine the quantitative relationship between the Bragg wavelengths of the gratings and the lateral deflection of the microstrip module was developed. This method does not require either knowledge of the exact position or calibration of the individual FBG sensor. The lateral deflection of the microstrip detector could be reconstructed with an accuracy of approximately10μm. The results obtained suggest that a better accuracy could be achieved by employing a larger number of FBG sensors.
机译:关于跟踪探测器的一个重要问题是它们会发生变形,如果不能忽略,则会使探测器的固有分辨率变差。本文的目的是评估光纤布拉格光栅(FBG)技术在固定热条件下监测硅微带检测器变形的准确性。为此,采用了与组成DAΦNE的FINUDA设备的顶点检测器的模块相同类型的检测器模块。将两个裸露的FBG传感器胶粘到硅微带检测器的边界附近,并将它们的响应与两个CCD激光位移传感器在24天内的响应进行比较。开发了一种确定光栅布拉格波长与微带模块横向偏转之间的定量关系的校准方法。此方法不需要了解单个FBG传感器的确切位置或校准。微带检测器的横向偏转可以以大约10μm的精度重建。获得的结果表明,通过使用大量的FBG传感器可以实现更好的精度。

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