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首页> 外文期刊>Nature Materials >Low-temperature, high-performance solution-processed metal oxide thin-film transistors formed by a 'sol-gel on chip' process
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Low-temperature, high-performance solution-processed metal oxide thin-film transistors formed by a 'sol-gel on chip' process

机译:通过“芯片上溶胶-凝胶”工艺形成的低温,高性能溶液处理的金属氧化物薄膜晶体管

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摘要

At present there is no 'ideal' thin-film transistor technology for demanding display applications, such as organic light-emitting diode displays, that allows combining the low-temperature, solution-processability offered by organic semiconductors with the high level of performance achievable with microcrystalline silicon1. N-type amorphous mixed metal oxide semiconductors, such as ternary oxides M_x~1M_y~2O_z, where M~1 and M~2 are metals such as In, Ga, Sn, or Zn, have recently gained momentum because of their high carrier mobility and stability and good optical transparency, but they are mostly deposited by sputtering. So far no route is available for forming high-performance mixed oxide materials from solution at low process temperatures <250 ℃. Ionic mixed metal oxides should in principle be ideal candidates for solution-processable materials because the conduction band states derived from metal s-orbitals are relatively insensitive to the presence of structural disorder and high charge carrier mobilities are achievable in amorphous structures. Here we report the formation of amorphous metal oxide semiconducting thin-films using a 'sol-gel on chip' hydrolysis approach from soluble metal alkoxide precursors, which affords unprecedented high field-effect mobilities of 10 cm~2 V~(-1) s~(-1) reproducible and stable turn-on voltages V_(on)≈OV and high operational stability at maximum process temperatures as low as 230 ℃.
机译:目前,对于诸如有机发光二极管显示器之类的要求苛刻的显示应用,还没有“理想的”薄膜晶体管技术,该技术可以将有机半导体提供的低温,溶液可加工性与可实现的高性能相结合。微晶硅1。 N型非晶态混合金属氧化物半导体(例如三元氧化物M_x〜1M_y〜2O_z)(其中M〜1和M〜2是In,Ga,Sn或Zn等金属)最近因其高载流子迁移率而获得发展势头稳定性和良好的光学透明性,但它们大多通过溅射沉积。迄今为止,尚无在低于250℃的低温下由溶液形成高性能混合氧化物材料的途径。原则上,离子混合金属氧化物应该是可溶液处理材料的理想候选材料,因为衍生自金属s轨道的导带状态对结构无序相对不敏感,并且在非晶结构中可以实现高电荷载流子迁移率。在这里,我们报道了使用可溶性金属醇盐前体的“芯片上溶胶-凝胶”水解方法形成的非晶态金属氧化物半导体薄膜,该薄膜提供了空前的10 cm〜2 V〜(-1)s的高场效应迁移率〜(-1)可重现且稳定的开启电压V_(on)≈OV,在最高工艺温度低至230℃时仍具有较高的工作稳定性。

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  • 来源
    《Nature Materials》 |2011年第1期|p.45-50|共6页
  • 作者单位

    Cavendish Laboratory, Department of Physics, University of Cambridge, Cambridge CB3 OHE, UK;

    Panasonic Corporation, Osaka 571-8501, Japan;

    Cambridge Liaison Office of Panasonic R&D Centre Europe, a division of Panasonic Europe Ltd., 18a Sheraton House, Castle Park, Cambridge CB3 OAX, UK;

    Cavendish Laboratory, Department of Physics, University of Cambridge, Cambridge CB3 OHE, UK,Electrical and Computer Engineering, EECS Department, University of Michigan, 1301 Beal Avenue, Ann Arbor, Michigan 48109-2122, USA;

    Multivalent Ltd, Eriswell, IP27 9BJ, UK;

    Cavendish Laboratory, Department of Physics, University of Cambridge, Cambridge CB3 OHE, UK;

    Cavendish Laboratory, Department of Physics, University of Cambridge, Cambridge CB3 OHE, UK;

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