Almost all thin films deposited on a substrate are in a state of stress. Fifty years ago pioneering work concerning the measurement of thin-film stresses was conducted by Brenner and Sender of. They electroplated a metal film onto a Thin metal substrate strip fixed at one End and measured the deflection of the Free end of the substrate with a microme- Ter. Using a beam-bending analysis, they Were able to calculate a residual stress From the measured deflection of the bi- Metallic film-substrate system.
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