机译:三维集成电路的硅通孔差分中的串扰建模
Hangzhou Dianzi Univ Sch Elect & Informat Minist Educ Key Lab RF Circuits & Syst Hangzhou 310018 Zhejiang Peoples R China;
crosstalk; three-dimensional integrated circuits; equivalent circuits; silicon; integrated circuit modelling; integrated circuit noise; interference suppression; three-dimensional integrated circuits; crosstalk effects; D-TSVs; equivalent circuit model; circuit elements; noise coupling; silicon substrate; differential through silicon vias; three-dimensional full-wave field solver HFSS; 3D HFSS; floating silicon substrate; Si;
机译:三维集成电路碳纳米管基屏蔽通孔通孔电气建模
机译:三维集成电路的硅通孔串扰模型和优化设计
机译:适用于高速三维集成电路(3-D IC)的低损耗气腔硅通孔(TSV)
机译:三维(3-D)集成电路中硅通孔(TSV)的紧凑建模
机译:对3D集成电路中通过硅通孔的热应力和可靠性的缩放和微观结构效应
机译:用于单片三维集成电路应用的低成本和低温多晶硅纳米线传感器阵列的制造
机译:通过3-D集成电路通过硅通孔的热管理