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A LAMINATE-BASED RF INTEGRATED PASSIVE DEVICE

机译:基于叠层的射频集成无源器件

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摘要

Size, cost and performance pressures have driven the industry to ever higher levels of RF integration. Dramatic progress has been made in the integration of the active functions but general adoption of passive integration (integrating functions such as RF filters, diplexers and baluns) has lagged behind. The industry has long sought an organic laminate-based alternative to the LTCC (low temperature co-fired ceramic) solutions that dominate the market. Laminates are a proven, reliable technology, but FR4-based solutions have historically exhibited inferior RF performance and high performance laminates have been too expensive.
机译:尺寸,成本和性能压力已将行业推向更高水平的RF集成。有源功能的集成已经取得了显着进步,但是无源集成(诸如RF滤波器,双工器和巴伦等集成功能)的普遍采用已经落后了。长期以来,该行业一直在寻求一种有机层压板替代LTCC(低温共烧陶瓷)解决方案的方法,该解决方案在市场上占主导地位。层压板是一种可靠的可靠技术,但是基于FR4的解决方案历来表现出较差的RF性能,而高性能层压板过于昂贵。

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